TXT
묘사:
Memory Microcircuit
MRC:
The maximum amount of electrical energy that can be expended by an item.AEHX
Maximum Power Dissipation Rating:
220.0 milliwatts
MRC:
The minimum and maximum limits of temperature at which the item is rated for operation.AFGA
Operating Tempurature Range:
-0.0/+70.0 degrees celsius
MRC:
The national stock number or the identification information of the end equipment for which the item is a part.AGAV
End Application:
5895-01-129-1827 communications central
MRC:
Those features,not otherwise specified,which may be required for proper functioning of the item.CBBL
Features Provided:
Static operation and erasable
MRC:
The chemical compound or mechanical mixture properties of which the inclosure is fabricated.CQSJ
Inclosure Material:
Ceramic
MRC:
Indicates the physical configuration of the inclosure.CQSZ
Inclosure Configuration:
Dual-in-line
MRC:
An indication of the basic electronic circuit elements assembled to output a logic function.CQWX
Output Logic Form:
N-type metal oxide-semiconductor logic
MRC:
The arrangement or pattern which describes the input circuitry of the item.CQZP
Input Circuit Pattern:
16 input
MRC:
The metallic,nonmetallic,and/or chemical properties with which the item is plated,dipped,and/or coated. the treatment is designed to protect the terminal surface(s) and cannot be wiped off.CWSG
Terminal Surface Treatment:
Solder
MRC:
The value of the voltage applied and type of specific electrical characteristic for which the item is designed.CZEN
Voltage Rating And Type Per Characteristic:
5.0 volts power source
MRC:
The acceptable time limitation for the item per characteristic.CZEQ
Time Rating Per Chacteristic:
300.00 nanoseconds propagation delay time, low to high level output
MRC:
Indicates the type of memory device used on the item.CZER
Memory Device Type:
Rom
MRC:
Indicates the type and number of terminals for providing electrical connection.TTQY
Terminal Type And Quantity:
18 printed circuit
