TXT
묘사:
Diode Semiconductor Device
MRC:
The dimension measured along the longitudinal axis with terminated points at the extreme ends of the item.ABHP
Overall Length:
Between 0.072 inches and 0.078 inches
MRC:
The distance measured in a straight line from the bottom to the top of an item.ABKW
Overall Height:
Between 0.030 inches and 0.040 inches
MRC:
An overall measurement taken at right angles to the length of an item,in distinction from thickness.ABMK
Overall Width:
Between 0.037 inches and 0.043 inches
MRC:
The specific purpose for which the item is designed.AFZC
Function For Which Designed:
Zener diode
MRC:
The means of attaching the item.AXGY
Mounting Method:
Terminal
MRC:
The chemical compound or mechanical mixture properties of which the semiconductor is fabricated.CTMZ
Semiconductor Material:
Silicon
MRC:
The value of the voltage that may be applied,expressed in volts,and the symbol used to identify the specific electrical characteristic.CTQN
Voltage Rating In Volts Per Characteristic:
5.88 breakdown voltage, dc
MRC:
The level of electrical flow and the symbol used to identify the specific electrical characteristic.CTQX
Current Rating Per Characteristic:
70.00 milliamperes source cutoff current horsepower metric
MRC:
The amount of electrical power that can be dissipated and the specific electrical characteristic.CTRD
Power Rating Per Characteristic:
400.0 milliwatts small-signal input power, common-collector preset
MRC:
The maximum temperature at which the item is designed to operate at each measurement point.CTSG
Maximum Operating Tempurature Per Measurement Point:
150.0 degrees celsius junction
MRC:
An indication of the precious material and its location in the item.PMLC
Precious Material And Location:
Eutectic die bonds surfaces terminals and land areas surfaces gold
MRC:
Identification of the precious material contained in the item.PRMT
Precious Material:
Gold
MRC:
Indicates the type and number of terminals for providing electrical connection.TTQY
Terminal Type And Quantity:
4 bonding pad
