부품 정보
Hardness critical process; junction pattern arrangement: pin
TXT
묘사:
Diode Semiconductor Device
MRC:
The element,compound,or mixture of which the inclosure is fabricated,excluding any surface treatment.ABBH
Inclosure Material:
Glass
MRC:
The dimension measured along the longitudinal axis with terminated points at the extreme ends of the item.ABHP
Overall Length:
Between 0.026 inches and 0.030 inches
MRC:
An overall measurement taken at right angles to the length of an item,in distinction from thickness.ABMK
Overall Width:
Between 0.006 inches and 0.010 inches
MRC:
The specific purpose for which the item is designed.AFZC
Function For Which Designed:
Detector
MRC:
The means of attaching the item.AXGY
Mounting Method:
Press fit
MRC:
The master requirement codes of those requirements which are technically critical by reason of tolerance,fit,performance,or other characteristics which affect identification of the item.CRTL
Criticality Code Justification:
Feat
MRC:
The value of the voltage that may be applied,expressed in volts,and the symbol used to identify the specific electrical characteristic.CTQN
Voltage Rating In Volts Per Characteristic:
4.0 breakdown voltage, instantaneous
MRC:
The amount of electrical power that can be dissipated and the specific electrical characteristic.CTRD
Power Rating Per Characteristic:
150.0 milliwatts small-signal input power, common-collector preset
MRC:
The maximum temperature at which the item is designed to operate at each measurement point.CTSG
Maximum Operating Tempurature Per Measurement Point:
175.0 degrees celsius junction
