부품 정보
Nuclear hardness process; junction pattern arrangement: pn
TXT
묘사:
Diode Semiconductor Device
MRC:
The element,compound,or mixture of which the inclosure is fabricated,excluding any surface treatment.ABBH
Inclosure Material:
Metal
MRC:
The dimension measured along the longitudinal axis with terminated points at the extreme ends of the item.ABHP
Overall Length:
Between 0.010 inches and 0.020 inches
MRC:
The distance measured in a straight line from the bottom to the top of an item.ABKW
Overall Height:
Between 0.005 inches and 0.010 inches
MRC:
The number of mounting facilities provided.AKPV
Mounting Facility Quantity:
1
MRC:
The means of attaching the item.AXGY
Mounting Method:
Threaded hole
MRC:
Those features,not otherwise specified,which may be required for proper functioning of the item.CBBL
Features Provided:
Burn in and gold plated leads
MRC:
The chemical compound or mechanical mixture properties of which the semiconductor is fabricated.CTMZ
Semiconductor Material:
Silicon
MRC:
The value of the voltage that may be applied,expressed in volts,and the symbol used to identify the specific electrical characteristic.CTQN
Voltage Rating In Volts Per Characteristic:
80.0 breakdown voltage, instantaneous
MRC:
The level of electrical flow and the symbol used to identify the specific electrical characteristic.CTQX
Current Rating Per Characteristic:
10.00 microamperes collector current, dc peak
MRC:
An indication of the nuclear hardness criticality of the item.NHCF
Nuclear Hardness Critical Feature:
Hardened
MRC:
An indication of the precious material and its location in the item.PMLC
Precious Material And Location:
Terminals gold
MRC:
Identification of the precious material contained in the item.PRMT
Precious Material:
Gold
MRC:
Indicates the type and number of terminals for providing electrical connection.TTQY
Terminal Type And Quantity:
1 unthreaded hole and 1 bonding pad
