부품 번호 5PTMBT15

Adhesive

가격 및 가용성

이 NSN의 현재 가격 및 가용성에 대해 이 양식을 제출하십시오.
부품 번호:
양:
이메일 주소:
전화:
참조:
회사:
이름:

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All major credit cards accepted as well as gov. p-cards

이 제품의 과거 가격은 224.16 and 302.616 USD. 수량, 가용성, 상태, 리드 타임 및 품목 중단 가능성에 따라 최신 견적을 제공할 때까지 가격을 보장할 수 없습니다.

부품 번호
비무장화
수명
UOM
NIIN
부품 번호:
5ptmbt15
비무장화:
No
수명:
N/A
측정 단위:
1 LB
NIIN:
015259305

부품 정보
Frabric, s-2 glass, woven epoxy resin impregnated for structural repair applications

NSN
국가 주식 번호:
8040-01-525-9305 8040015259305
TXT
묘사:
Adhesive
INC
INC
아이템 이름 코드:
11297
MRC:
The national stock number or the identification information of the end equipment for which the item is a part.AGAV
End Application:
F/a-22 raptor
MRC:
The recognized shape,configuration,structure,or mold of a substance,natural or refined,that most nearly corresponds to the appearance of the item.AGXW
Physical Form:
Film
MRC:
Indicates the designed use of the item.ALCD
Usage Design:
For use in aerospace structures
MRC:
A process by which the item is preserved.AMEX
Curing Method:
Heat
MRC:
Those unusual or unique characteristics or qualities of an item not covered in the other requirements and which are determined to be essential for identification.FEAT
Special Features:
The materials shall be stored at 10 degrees f or below in the sealed vapor barrier bag, one roll per bag manufacture description of p/n 107077 is 6781gl 8552, 37%, 203 aw, 50 inch. 6781gl is 8 harness satin s2 fiberglass style 6781 woven fabric, 8552 is the epoxy resin, 37% is the resin content, 203aw is the areal weight in grams per square meter, 50 inch is the width of roll
MRC:
A characteristic of light that can be specified in terms of luminance,dominant wavelength,and purity.HUES
Color:
Yellow
MRC:
Characteristics or qualities of an item,not covered in any other requirement,which are considered essential information for one or more functions excluding nsn assignment.SUPP
Supplementary Features:
After placing the prepared layup in the appropriate curing equipment, refer to specification 5ptmbt15-a, page 31, para 4.4.2.3.1 for curing cycle

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