부품 정보
Programmed pal, 22v10
MRC:
The minimum and maximum limits of temperature at which the item is rated for operation.AFGA
Operating Tempurature Range:
-55.0/+125.0 degrees celsius all memory
MRC:
An indication of the functional relationship of the components.ASDD
Component Function Relationship:
Matched
MRC:
The chemical compound or mechanical mixture properties of which the inclosure is fabricated.CQSJ
Inclosure Material:
Ceramic all memory
MRC:
Indicates the physical configuration of the inclosure.CQSZ
Inclosure Configuration:
Dual-in-line all memory
MRC:
The basic purpose and number of functions of the device,modified by its intended use.CSSL
Design Function And Quantity:
10 memory, programmed array logic all memory
MRC:
The metallic,nonmetallic,and/or chemical properties with which the item is plated,dipped,and/or coated. the treatment is designed to protect the terminal surface(s) and cannot be wiped off.CWSG
Terminal Surface Treatment:
Solder err-100 err-100
MRC:
Indicates the type and number of microcircuit devices provided.CZEM
Microcircuit Device Type And Quantity:
10 memory
MRC:
The value of the voltage applied and type of specific electrical characteristic for which the item is designed.CZEN
Voltage Rating And Type Per Characteristic:
7.0 volts power source err-100
MRC:
The acceptable time limitation for the item per characteristic.CZEQ
Time Rating Per Chacteristic:
30.00 nanoseconds delay all memory
MRC:
Indicates the type of memory device used on the item.CZER
Memory Device Type:
Pal err-100 err-100
MRC:
Indicates the type and number of terminals for providing electrical connection.TTQY
Terminal Type And Quantity:
24 printed circuit all memory
